Basic PB3^TM Educational, Training and R&D 

Plasma & Sputtering Systems  

The BASIC PB3^TM Tabletop Plasma System offers simple features and is built on top of our Model PB3 RF power system. The user is encouraged to supply the necessary components from their own lab to configure it for the intended process. 

Basic PB3 Tabletop Plasma System PN 00003504

This system includes these standard components:

• 6" diameter stainless, 4 way cross vacuum process chamber with NW160 ISO flanges

• Sturdy aluminum base plate/yoke chamber mounting (on top of the PB3 RF system cabinet)

• KF40 pump port

• Pressure gauge port located on the rear flange

• Front mounted access door with 4" diameter float glass view port 

• Adjustable height 4" diameter, grounded, non-rotary, substrate holder

• Manually operated 1/4" toggle vent valve 

• Manually operated 1/4" process gas needle and shutoff valves

• Model PB3 Analog metered, integrated RF power system

Select the following options to configure the system: (click on the link to go to the component web page)

      Fittings and Components

• KF40 inline, stainless/viton, butterfly valve (for pumping speed control) PN 00003439

• KF40 inline, aluminum/viton, butterfly valve (for pumping speed control) PN 00003685

• KF40 inline, stainless/fluorocarbon, inline poppet valve (for isolating the chamber) PN 00003699

• KF40 90 degree stainless EL PN 00008119

• KF40 centering ring aluminum/Viton PN 00008116

• KF40 hinged clamp with wingnut PN 00008117

• NW160 double claw clamps PN 00008329

• NW160 flange seal, aluminum/Viton PN 00008330

• NW160 blank flange, aluminum PN 00003528

• NW160 blank flange, stainless PN 00008307

      RF Power Systems ( 13.56MHz) 

• Model PB3-100M Integrated RF generator rated 100 watts (for use with magnetron sputtering or capacitive etch sources) PN 00001782

• Model PB3-300M Integrated RF generator rated 300 watts (for use with magnetron sputtering or capacitive etch sources) PN 04-140031-01

      Plasma Sources

• 4" diameter magnetron sputtering cathode head PN 00003688

• 2" diameter magnetron sputtering cathode head PN 00003692

• Sputtering target materials - discuss with factory

• Capacitive plasma etch head PN 00002515

The user will be required to furnish the following facilities:

• 190>240 VAC 50/60 Hz AC mains input (current demand based on power supply selection)

• Process gas bottle, regulator, 1/4" tubing to connect to the system

• Dry air or additional bottled gas for venting, 1/4" tubing to connect to the system

• Flat tabletop surface upon which to sit the system

The user will be required to furnish these additional components to complete the system:

• Rough vacuum pump 

• Miniature turbo pump (for high vacuum applications)

• Vacuum bellows or plastic hose to connect the pump to the KF40 fitting on the vacuum chamber

• Vacuum pressure gauge

• Enclosure for the electronics and controls

Typical spare parts are listed below - please contact the factory for a quote on specific part numbers for your system.

• Float glass view port & o-ring
• Sputtering target material
• O-ring and flange seals

Call 203.270.8797 to speak with a Manitou engineer about your application, or send us an e-mail. We’ll help you select the right model for your application.

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Manitou Systems Inc.
18 Commerce Road, Newtown, CT. 06470
Tel.203.270.8797 Fax.203.270.8786

This website has been revised as of 03.25.07

Any technical specification described on this website is subject to change without prior notice.

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All Rights Reserved 2007, Manitou Systems, Inc. 18 Commerce Road, Newtown, CT. 06470